ERSAscope inspection

This inspection process allows us to check and verify the thermal reflow process, we can also confirm the correct condition of the spheres of the device. Only by checking such information can our engineers provide assurance of a reliable and correct BGA placement.

Evidence of incorrect placement can also be detected, such as flux residues and metallic particles, these can be found and rectified. These potential errors are currently unable to be found by x-ray methods